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Seeed Studio | Super Edge AI

reComputer Super J3011 – Super Mode

Jetson Orin Nano 8GB system with Super Mode, 67 TOPS and deployment-ready connectivity.

Overview

Product overview

reComputer Super J3011 – Super Mode is a B2B-ready system from Seeed Studio selected for the Minidis portfolio. It is designed for robotics, industrial automation, real-time inference, machine vision and combines deployment-ready hardware with a practical interface set for real-world edge projects.

Why choose this product

  • 67 TOPS in MAXN_SUPER mode
  • Ready for edge AI and robotics deployment
  • Rich interfaces including CSI, CAN and Ethernet
  • Supports NVIDIA, ONNX, PyTorch and ROS workflows

Typical applications

Robotics, industrial automation, real-time inference, machine vision.

Key specifications

  • CPU / Module: NVIDIA Jetson Orin Nano 8GB
  • Memory: 8GB LPDDR5
  • Storage: 128GB M.2 NVMe SSD included
  • Networking: 2× RJ45 Gigabit Ethernet; M.2 Key E; mini-PCIe for LTE
  • I/O: 4× USB 3.2 Type-A, USB Type-C debug, HDMI 2.1, 4× CSI, CAN, 40-pin header
  • Operating system: JetPack 6.2 / Linux BSP pre-installed
  • Operating temperature: -10°C to 60°C
  • Dimensions: 130 × 120 × 66 mm

Need support with deployment, branding or configuration? Minidis can help with business registration, project advice and rollout support.

Highlights

Key features

  • 67 TOPS in MAXN_SUPER mode
  • Ready for edge AI and robotics deployment
  • Rich interfaces including CSI, CAN and Ethernet
  • Supports NVIDIA, ONNX, PyTorch and ROS workflows
Technical details

Technical specifications

SKU114110312
CPU / platformNVIDIA Jetson Orin Nano 8GB
Memory8GB LPDDR5
Storage128GB M.2 NVMe SSD included
Networking2× RJ45 Gigabit Ethernet; M.2 Key E; mini-PCIe for LTE
I/O4× USB 3.2 Type-A, USB Type-C debug, HDMI 2.1, 4× CSI, CAN, 40-pin header
Operating systemJetPack 6.2 / Linux BSP pre-installed
Temperature-10°C to 60°C
Dimensions130 × 120 × 66 mm
Documentation

Product datasheet

View or download the complete technical datasheet for specifications, interfaces, environmental ratings and mechanical details.