Seeed Studio | Industrial Edge AI
reComputer Industrial J3011 – Orin Nano 8GB
Fanless industrial Jetson Orin Nano 8GB system with industrial I/O and wide-temp support.
Overview
Product overview
reComputer Industrial J3011 – Orin Nano 8GB is a B2B-ready system from Seeed Studio selected for the Minidis portfolio. It is designed for industrial automation, ai gateways, machine vision, smart factories and combines deployment-ready hardware with a practical interface set for real-world edge projects.
Why choose this product
- Fanless passive heatsink design
- Industrial I/O for automation and gateway projects
- Hybrid connectivity with Nano SIM and optional 4G/5G/LoRaWAN
- Flexible desk, DIN rail, wall and VESA mounting
Typical applications
Industrial automation, AI gateways, machine vision, smart factories.
Key specifications
- CPU / Module: NVIDIA Jetson Orin Nano 8GB
- Memory: 8GB LPDDR5
- Storage: 128GB NVMe SSD included
- Networking: 2× GbE RJ45 (1× PoE PSE 802.3af); optional 4G/5G/LoRaWAN/Wi-Fi expansion
- I/O: 3× USB 3.2, 1× USB Type-C device, 1× USB Type-C debug, 4× DI, 4× DO, DB9 RS232/422/485, CAN, HDMI 2.0, 2× CSI
- Operating system: JetPack 5.1.3 / Linux BSP pre-installed
- Operating temperature: -20°C to 60°C
- Dimensions: 159 × 155 × 57 mm
Need support with deployment, branding or configuration? Minidis can help with business registration, project advice and rollout support.
Highlights
Key features
- Fanless passive heatsink design
- Industrial I/O for automation and gateway projects
- Hybrid connectivity with Nano SIM and optional 4G/5G/LoRaWAN
- Flexible desk, DIN rail, wall and VESA mounting
Technical details
Technical specifications
| SKU | 110110193 |
|---|---|
| CPU / platform | NVIDIA Jetson Orin Nano 8GB |
| Memory | 8GB LPDDR5 |
| Storage | 128GB NVMe SSD included |
| Networking | 2× GbE RJ45 (1× PoE PSE 802.3af); optional 4G/5G/LoRaWAN/Wi-Fi expansion |
| I/O | 3× USB 3.2, 1× USB Type-C device, 1× USB Type-C debug, 4× DI, 4× DO, DB9 RS232/422/485, CAN, HDMI 2.0, 2× CSI |
| Operating system | JetPack 5.1.3 / Linux BSP pre-installed |
| Temperature | -20°C to 60°C |
| Dimensions | 159 × 155 × 57 mm |
Documentation
Product datasheet
View or download the complete technical datasheet for specifications, interfaces, environmental ratings and mechanical details.