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FITLET3, Intel® Atom CJ6413 4Core 2Ghz TDP12W, with terminalblock (RS232/485 and GPIO's)
(Item no.: FITLET3-CJ6413-S-W210M)
Barebone fitlet3-CJ6413-S-W210M with Celeron J6413 (4C, 2.0GHz, 12W) , Terminal block w/ RS-232, RS-485, GPIOs and M.2 module Intel AX210 WiFi/BTBT
Available FACET-Cards
FACET Card interface includes 2x PCIe, USB, eDP 1.3 and I2C.
Mounting options
VESA / wall mounting bracket*
DIN-rail mounting bracket*
* = Optional ;
Specifications
RAM | Up to 32 GB 1x SO-DIMM 204-pin DDR4 Non-ECC DDR4-3200MT/S |
STORAGE | M.2 Key-M accepts SATA of NVME modules, 2230, 2242, 2260 or 2280 |
DISPLAY | mini DP 1.2 | DP 1.2 (up to 4096 x 2160 @ 60Hz) Dual mode HDMI 1.4b | HDMI 1.4b (up to 3840 x 2160 @ 30Hz) |
LAN | 2x Gigabit on-board Ethernet ports on RJ45 (2x Intel® i210 1000 Mbps / 100 Mbps / 10 Mbps) LAN- Up to 4x Gbit Ethernet Intel I210 (via optional FLAN card) Additional 2x GbE LAN on RJ45 on FC3-LAN FACET Card Additional 1x GbE LAN on SFP+ for optical LAN on FC3-OPLN FACET Card Additional 1x GbE LAN on RJ45 with PoE device capabilities on FC3-POED FACET Card |
WIRELESS | M.2 Key-E 1 Optional On-board module with Wi-Fi 6E, BT 5.2, for M.2 2230 module with Wi-Fi 6E, BT 5.2 |
CELLULAR | LTE/WCDMA/GSM/GNSS M.2 Key-B Available using M.2 Key-B socket on a fitlet3 SBC for M.2, LTE/5G modem, with micro-SIM tray. fitlet3 SBC is equipped by micro-SIM socket. |
I/O | USB 6 on-board ports (2x USB 3.0 + 4x USB 2.0) Audio (*optional) provided upon request Optional analog output, analog input on 3.5 mm jacks HDMI & DP audio |
Isolated serial and GPIO, up to 24V, on terminal block Optional isolated RS-232/422/485 2x isolated GPI + 2x isolated GPO |
|
BIOS | AMI Aptio |
POWER | Input voltage 7-342V DC / 5-25Watt - reverse polarity protected |
OS SUPPORT | Windows 10 Pro Windows 10 LTSC 2021 IoT Enterprise Windows 11 Pro Linux Mint Compatible with other Windows 10 /11 variants. Compatible with other Linux variants. Compatible with other hypervisors and operating systems (e.g. ESXi, FreeBSD) |
DIMENSIONS | Standard housing: 132.8 mm X 100 mm X 34.8 mm Industrial housing: 140 mm X 111 mm X 34.8 mm Unit Weight 420Gr |
HOUSING/COOLING | All metal housing Aluminium zinc die cast parts Fanless convection cooling through the housing, no vents |
ENVIRONMENT | Operating temperature range -Up to -40°C to 85°C* Relative humidity -5% – 95% non-condensing |
SHOCK&VIBRATION | MIL STD 810G compliant Vibration test: IEC TR 60721-4-7:2001+A1:03, Class 7M1, test method IEC 60068-2-64 (up to 2 KHz , 3 axis) Shock test: IEC TR 60721-4-7:2001+A1:03, Class 7M1, test method IEC 60068-2-27 (15g , 6 directions) |
Available FACET-Cards
FC3-FLAN | 2x Dual Lan 1Gbit Fitlet2 internal facet card |
FC3-FPOE | 1x 1Gbit LAN with POE (power to fitlet3) |
FC3-FSFP | 1x SFP 1Gbit LAN adapter |
FACET Card interface includes 2x PCIe, USB, eDP 1.3 and I2C.
Mounting options
VESA / wall mounting bracket*
DIN-rail mounting bracket*
* = Optional ;